Sponsors and Exhibitors

SPONSORS

Two Types of Sponsors are called. Please email wlf5-sec@iclhq.org for any questions.

Type A (JPY 500, 000)

1. Use of one of 14 booths in Hall E (Click HERE to see the layout of Hall E)

12 booths (WxD: 4m x 3 m) (Booths are prepared by the OC)
2 booths (WxD: 5 m x 4 m) (Space for booth are prepared. Layout is free)

2. One full page technical introduction in 9 volumes of full color books (Vol.1, Vol.2-1, Vol.2-2, Vol.3, Vol.4, Vol.5, Vol.6, Vol.7, Vol.8) and WLF5 electronic proceedings.

3. Sponsor panel (WxH: 1.2 m x 2.1m) at the center of the Venue.

4. Presentation of the certificate of appreciation for sponsors at the closing ceremony.

5. Sponsor banners (logo, name of company and link to its web) in WLF5 web

6. Names of sponsors published in all issues of Journal Landslides until the end of WLF5

7. 3 non-speaker tickets

Currently registered sponsors: Marui & Co., Ltd., NIPPON KOEI Co., Ltd., OSASI Technos Inc., GODAI Corporation, Japan Conservation Engineers & Co., Ltd., OYO Corporation, Kokusai Kogyo Co., Ltd., Geobrugg AG, Ellegi srl (LISALab), Chuo Kaihatsu Corporation.

Type B (JPY 300, 000)

1. Sponsor banners (logo, name of company and link to its web) in WLF5 web

2. One full page technical introduction in WLF5 electronic proceedings.

3. Sponsor panel (WxH: 1.2 m x 2.1m) at the center of the Venue.

4. 4 non-speaker tickets.

5. Presentation of the certificate of appreciation for sponsors at the closing ceremony.

Currently registered sponsors: Kiso-Jiban Consultants Co., Ltd., Okuyama Boring Co., Ltd., Kawasaki Geological Engineering Co., Ltd.

Click HERE for Preliminary Registration for Sponsors of WLF5.

Contact:
WLF5 secretariat in Kyoto, Japan:  <wlf5-sec@iclhq.org>